SVM 60-60Multi-Wire Graphite Cutting Machine
Key Specs :
- Parallel Wires: 4
- Max Workpiece Size: 600 × 600 × 600 mm
- Typical Wire Speed: up to 80 m/s
- Wire Diameter Range: 0.3 – 0.8 mm
- Typical Kerf Width: 0.35 – 0.9 mm
Cutting Structure and Principle
Compact Vertical Structure
Saves floor space and enables convenient loading of graphite blocks from the front or top.Endless Diamond Wire Saw Technology
The machine uses a continuous-loop diamond wire for cutting. The wire moves unidirectionally at high speed, producing smooth, burr-free cuts with minimal material loss. This method eliminates reverse-stroke marks common in traditional wire saws.Key Features and Advantages
CNC Automatic Control
Fully automated worktable movement enables precise multi-slice operations with programmable thickness control.Large Workpiece Capacity
Capable of cutting graphite blocks up to 600mm × 600mm, ideal for large-scale graphite processing.High Cutting Precision
Achieves slicing accuracy up to ±0.05mm, suitable for applications requiring ultra-flat surfaces.Stable Workpiece Support
Gravity-assisted vertical clamping ensures consistent slicing with low vibration.Endless Wire Auto Tensioning System
Maintains consistent cutting pressure and wire stability throughout long operations.Low Dust, Clean Cutting Process
The continuous unidirectional motion reduces vibration and dust generation, ideal for cleanroom environments.Smart Operation Interface
Equipped with a touchscreen for intuitive operation, parameter input, and process monitoring.- Simple Setup and Operation
Intuitive touchscreen control panel with programmable slicing thickness and speed. - This machine can make 4 cuts per feed
| Parameter | Specification |
|---|---|
| Parallel Wires | 4 (2/3/4 optional) |
| Max Workpiece Size (L×W×H) | 600 × 600 × 600 mm |
| Wire Type | Endless Diamond Wire (Loop Type) |
| Wire Diameter Options | 0.30 / 0.35 / 0.42 / 0.80 mm |
| Wire Speed Range | 0 – 85 m/s (typ. 80 m/s) |
| Wire Tension | 100 – 300 N (closed-loop control) |
| Feed System | Servo feed, constant-speed or constant-load |
| Cutting Mode | Dry (default); optional mist suppression or wet cut |
| Dust Management | High-vacuum extraction, optional HEPA |
| Control System | PLC, process recipe management |
| Connectivity | Ethernet, optional OPC-UA / remote diagnostics |
| Power Supply | Configurable per region and wire count |
| Installation Footprint | Provided in downloadable layout drawing |
Comparison Between Diamond Band Saw and a Single Diamond Wire Saw
Aspect | Diamond Band Saw | Endless Diamond Wire Saw |
Cutting Mechanism | Utilizes a continuous loop of diamond-coated band as the cutting tool. | Employs a continuous loop of diamond-coated wire as the cutting tool. |
Cutting Speed | Generally slower cutting speed due to the movement of the band. | Faster cutting speed due to the continuous linear motion of the wire. |
Kerf Width | Typically has a wider kerf width, leading to more material wastage. | Minimizes kerf width, resulting in minimal material wastage. |
Cut Surface Quality | May require additional polishing steps to achieve a smooth finish. | Simultaneously cuts and polishes, ensuring a smooth and shiny surface. |
Versatility | Suitable for basic cuts and straight lines. | Highly versatile, suitable for complex shapes and intricate designs. |
Precision | Moderate precision; may not achieve intricate designs accurately. | Offers high precision, ideal for intricate graphite components. |
Material Efficiency | Can be less material-efficient due to wider cuts. | Maximizes material efficiency with narrow cuts. |
Dust Generation | Generates more dust, potentially requiring dust extraction systems. | Produces minimal dust, contributing to a cleaner working environment. |
Application | Mainly used for simpler cutting tasks | Ideal for various cutting needs, especially intricate graphite parts. |
Ideal Use Case | Basic straight cuts in graphite. | Precision cuts, intricate designs, and complex graphite components. |
Large Block Graphite Slicing
Precisely slicing thick and oversized graphite blocks into uniform slabs with minimal kerf loss.
Ideal for EDM graphite electrodes, semiconductor base plates, and high-temperature structural components.
Graphite Inner Contour Cutting
Creating intricate internal profiles such as holes, slots, and cavities within graphite materials.
Suitable for customized electrode manufacturing and specialized electronic parts production.
Graphite Outer Profile Cutting
Shaping complex external outlines, including circles, irregular frames, and custom geometries.
Perfect for producing graphite molds, fixtures, and battery components.
Multi-Slice High-Throughput Cutting
Enabling efficient multi-slice operations for mass production of graphite sheets for lithium battery anodes and solar cell backplanes.
What is the maximum thickness the machine can handle for cutting?
What is the difference between this wire saw and BAND SAW?
The cutting speed would be similar, but wire saw’s cut surface quality is far more better. and the kerf loss is smaller.